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Multilayer PCB Singulation Equipment


Multilayer PCB Singulation Equipment Product Description:

Model:           YSPEL
Size(mm):         730 X 810 X 1700
Power supply(v):  110/220
Depression(Pa):   0.45-0.70
Weight(Kg):       530/700


FPC /PCB punching (YSPL)
1.Depaneling PCB/FPC by means of punching dies, to avoid micro-cracks caused by manual. 
2.Cast iron framework for rigidity. Punching dies are changeable. Easy set up of punching dies. 
3.Moveable lower die for easy loading and unloadingPCB punch die| FPC die| PCB punch mold| FPC mould

CONTACT US
YUSH Electronic Technology Co.,Ltd
Contacts:Eva Liu +86 13416743702 / +86 13450659407
Tel:86-0512-62751429
Fax:86-0512-62751429
Website:http://www.vcutpcbdepaneling.com
Email: evaliu@hk-yush.com / sales@yushunli.com
Company Address:3 Building NO 11,Chunhui Road,
Suzhou Industrial Park,Jiangsu Province,China.
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